Apply V DC Apply the above specified voltage between adjacent contacts forminute. EIA Temperature Rise versus Current: EIAA: MethodMethodology: A cable-to-board configuration was used as a representative of the entire range of. MT-Contact series connector options. Exceptions per EIA Cycle between°C/80%RH and°C/50%RHRamp hr, dwell 1hr, dwell EIA Applicable to both receptacle and plug. EIA, Method III, w/o optional cold shock and vibration. The male throughboard connector was soldered to a single layer PCB. The parts were wired up to create a circuit in series; the female cable EIA, Condition VII, Level E Frequency RangeHz Power chamber held in the fixture as specified in EIA One thermocouple shall be placed on the supply wire/cable or PCB as applicable to insure that the wire/cable/PCB is not influencing to the test data. 外观无明显损坏，接触电阻满足要求，绝缘 电阻>MΩ Temperature Life (Preconditioning) 温度寿命(预处 理) EIA, Method A EIA Insulation Resistance Test Procedure for Electrical Connectors, Sockets and Coaxial Contacts EIA Low Level Contact Resistance Test Procedure for Electrical Connectors and Sockets EIA Impact Test Procedure for Electrical Connectors EIA Temperature Rise Versus Current Test Procedure for Electrical TPC Temperature Rise Versus Current Test Procedure for Electrical Connectors and Sockets. Thermocouple Wires Thermocouple Wire Jacket Thermocouple Weld Heat Sink Compound Pin Under Test Socket Under Test EIA, Method A °C, hrs 测试标准 EIAA, Method A, condition℃， 小时, 公母配插 No evidence of physical damages Meet LLCR requirement Isulatio v > MΩ Mi v. > MΩ insulation resistance , · EIA Simulated, feet altitude Altitude Low Temperature Insulation resistance greater than 5, megohms while mated EIA establishes a uniform set of industry standards for evaluating the environmental performance of sockets and electrical connectors in controlled environment applications EIA and IEC Random Vibration No discontinuities ofmicrosecond or greater. This procedure establishes the test procedures for determining temperature rise versus current for connectors and sockets with conductor sizes equal to or less than AWG or equivalent.
Apply V DC Apply the above specified voltage between adjacent contacts forminute. EIA Temperature Rise versus Current: EIAA: MethodMethodology: A cable-to-board configuration was used as a representative of the entire range of. MT-Contact series connector options. Exceptions per EIA Cycle between°C/80%RH and°C/50%RHRamp hr, dwell 1hr, dwell EIA Applicable to both receptacle and plug. EIA, Method III, w/o optional cold shock and vibration. The male throughboard connector was soldered to a single layer PCB. The parts were wired up to create a circuit in series; the female cable EIA, Condition VII, Level E Frequency RangeHz Power chamber held in the fixture as specified in EIA One thermocouple shall be placed on the supply wire/cable or PCB as applicable to insure that the wire/cable/PCB is not influencing to the test data. 外观无明显损坏，接触电阻满足要求，绝缘 电阻>MΩ Temperature Life (Preconditioning) 温度寿命(预处 理) EIA, Method A EIA Insulation Resistance Test Procedure for Electrical Connectors, Sockets and Coaxial Contacts EIA Low Level Contact Resistance Test Procedure for Electrical Connectors and Sockets EIA Impact Test Procedure for Electrical Connectors EIA Temperature Rise Versus Current Test Procedure for Electrical TPC Temperature Rise Versus Current Test Procedure for Electrical Connectors and Sockets. Thermocouple Wires Thermocouple Wire Jacket Thermocouple Weld Heat Sink Compound Pin Under Test Socket Under Test EIA, Method A °C, hrs 测试标准 EIAA, Method A, condition℃， 小时, 公母配插 No evidence of physical damages Meet LLCR requirement Isulatio v > MΩ Mi v. > MΩ insulation resistance , · EIA Simulated, feet altitude Altitude Low Temperature Insulation resistance greater than 5, megohms while mated EIA establishes a uniform set of industry standards for evaluating the environmental performance of sockets and electrical connectors in controlled environment applications EIA and IEC Random Vibration No discontinuities ofmicrosecond or greater. This procedure establishes the test procedures for determining temperature rise versus current for connectors and sockets with conductor sizes equal to or less than AWG or equivalent.
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