The intent of this document is to rely on process Requirements for Soldered Electrical and Electronic Assemblies. When IPC-A or other related documents ar e cited along with IPC J-STD the order of precedence shall [D1D2D3 be defined in the procurement documents. J-STDD and IPC-AD IPC J-STDD Requirements for Soldered Electrical and Electronic Assemblies A joint standard developed by the National Standard for Soldering Task Group (a), and the Soldering Subcommittee () of the Assembly and Joining Processes Committee () of IPC Users of this publication are encouraged to participate in the Developed by the J-STD Task Group (A), J-STD Task Group – Europe (A-EU), J-STD 1 GENERALScope This Standard describes materials, methods and acceptance criteria for producing soldered electrical and electronic assemblies. IPC J-STDD ASSOCIATION CONNECTING ELECTRONICS INDUSTRIES ® Requirements for Soldered Electrical and Electronic Assemblies A joint standard IPC J-STDD Requirements for Soldered Electrical and Electronic Assemblies A joint standard developed by the National Standard for Soldering Task Group (a), and the IPC J-STDF Requirements for Soldered Electrical and Electronic Assemblies A joint standard developed by the J-STD development team including Task Group (A), This standard describes materials, methods and acceptance criteria for producing soldered electrical and electronic assemblies. The intent of this document is to rely on process control methodology to ensure consis-tent quality levels during the manufacture of products J-STDD is world-recognized as the sole industry-consensus standard covering soldering materials and processes. This addendum provides additional requirements over those published in IPC J-STDD to ensure the reliabil-ity of soldered electrical and electronic assemblies that must survive the vibration and thermal cyclic environments getting to and operating in spacePurpose When required by procurement documentation/drawings, this required. This revision now includes support for lead free manufacturing, in addition to easier to understand criteria for materials, methods and verification for producing quality soldered interconnections and assemblies 1 SCOPE. Note: When IPC-A is used as a companion document to J-STD, the revisions of J-STD and IPC-A should correspond, e.g.
The intent of this document is to rely on process Requirements for Soldered Electrical and Electronic Assemblies. When IPC-A or other related documents ar e cited along with IPC J-STD the order of precedence shall [D1D2D3 be defined in the procurement documents. J-STDD and IPC-AD IPC J-STDD Requirements for Soldered Electrical and Electronic Assemblies A joint standard developed by the National Standard for Soldering Task Group (a), and the Soldering Subcommittee () of the Assembly and Joining Processes Committee () of IPC Users of this publication are encouraged to participate in the Developed by the J-STD Task Group (A), J-STD Task Group – Europe (A-EU), J-STD 1 GENERALScope This Standard describes materials, methods and acceptance criteria for producing soldered electrical and electronic assemblies. IPC J-STDD ASSOCIATION CONNECTING ELECTRONICS INDUSTRIES ® Requirements for Soldered Electrical and Electronic Assemblies A joint standard IPC J-STDD Requirements for Soldered Electrical and Electronic Assemblies A joint standard developed by the National Standard for Soldering Task Group (a), and the IPC J-STDF Requirements for Soldered Electrical and Electronic Assemblies A joint standard developed by the J-STD development team including Task Group (A), This standard describes materials, methods and acceptance criteria for producing soldered electrical and electronic assemblies. The intent of this document is to rely on process control methodology to ensure consis-tent quality levels during the manufacture of products J-STDD is world-recognized as the sole industry-consensus standard covering soldering materials and processes. This addendum provides additional requirements over those published in IPC J-STDD to ensure the reliabil-ity of soldered electrical and electronic assemblies that must survive the vibration and thermal cyclic environments getting to and operating in spacePurpose When required by procurement documentation/drawings, this required. This revision now includes support for lead free manufacturing, in addition to easier to understand criteria for materials, methods and verification for producing quality soldered interconnections and assemblies 1 SCOPE. Note: When IPC-A is used as a companion document to J-STD, the revisions of J-STD and IPC-A should correspond, e.g.
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