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<p>( 2220 series) 1рс- 2222 rigid 1pc- 2223 flex 1рс- 2221 generic design.  年12月 ipc- 2222a- cn 1 刚性有机印制板设计分标准 1范围 本标准建立了刚性有机印制板设计的专用要求。 1.  the ipc invites input on the effectiveness of the documentation and encourages user response through completion of ‘ ‘ suggestions for improvement’ ’ forms located at the end pdf of each document.  hierarchy of ipc design specifications.  ipc- 2222b used in conjunction with ipc- 2221, establishes the specific requirements for the design of rigid organic printed boards and other forms of component mounting and interconnecting structures.  design guide for the packaging of high speed electronic circuits.  for passive or constraining core boards the materials shall be in accordance with ipc- 2221.  ipc- 2221a generic standard on printed board design developed by the ipc- 2221 task group ( d- pdf 31b) of the rigid printed board committee ( d- 30) of ipc users of this publication are encouraged to participate in the development of future revisions.  ipc- 2222b sectional design standard for rigid organic printed boards developed by the ipc- 2221/ 2222 task group ( d- 31b) of the rigid printed board committee ( d- 30) of ipc users of this publication are encouraged to participate in the development of future revisions.  used in conjunction with ipc- 2221, ipc- 2222 establishes the specific requirements for the design of rigid organic printed boards and other forms of component mounting and interconnecting structures.  contact: ipc supersedes: ipc- 2222a - december ipcfebruary 1998 ipc- d- 275 - september 1991 ® this is a preview of  ipc 2222b- .  takes precedence.  publication date.  ipc- eg- 140 specification for finished fabric woven.  benefits of flex due to the thin films used in flexible circuitry, flex can save weight and space and conform to three- dimensional configura- tions.  1 目的 本标准包含的要求旨在建立有机印制板的专用设计细节， 应当与ipc- 2221结合使用， 以形成用于 贴装和连接元器件的设计。.  contact: ipc 2215 sanders road northbrook, illinoistel 847 509.  6 ipc- sm- 782 surface mount design and land pattern standard ipc- 2221 generic standard on printed board design ipc- 2222 ipc- 2223 ipc- 4101 specification for base materials for rigid and multilayer printed boards users of this standard are encouraged to participate in the development of future revisions.  qualification and performance specification for flexible printed boards.  1 institute for interconnecting and packaging elec- tronic circuits ( ipc) 1.  hierarchy of ipc design specifications ( 2220 series) ipc- 2222 rigid ipc- 2223 flex ipc- 2224 pcmcia ipc- 2225 mcm- l ipc- 2226 hdis ipc- 2227 discrete.  this standard applies to single- sided, double- sided or multi- layered boards.  1 institute for interconnecting and packaging elec- tronic circuits ( ipc) 1 ipc- eg- 140 speciﬁcation for finished fabric woven from ‘ ‘ e’ ’ glass for printed board.  2) used in the manufacture of hdi printed boards.  developed by the ipc- 2221/ 2222 task group ( d- 31b) of the rigid printed board committee ( d- 30) of ipc.  developed by the ipc 2222 pdf ipc- 2221/ 2222 task group ( d- 31b) of the rigid printed board committee ( d- 30) of ipc users of this publication are encouraged to participate in the development of future revisions.  the ipc- 2222b standard applies to single- sided, double- sided, or multi- layered boards.  ipc- 2222- pdf sectional design standard for rigid organic printed boards.  ipc- 2222 sectional design standard for rigid organic printed boards developed by the ipc- d- 275 task group ( 0- 31b) of the rigid printed board committee ( d- 30) of ipc ansi users of this standard are encouraged to panicipate in the development of future revisions.  key concepts in this document are: rigid laminate.  sectional design standard for rigid organic printed boards.  dance with ipc- 2222 for rigid and ipc- 2223 for ﬂexible core interconnections.  the revision of the document in effect at the time of solici- tation shall take precedence.  sectional design standard for rigid organic printed boards.  2 hdi types the design designation system of this standard recognizes the six industry approved design types ( see 5.  contact: 2215 sanders road northbrook, ilinoistel 847 509.  this sec- tional standard, used in conjunction with ipc- 2221, supersedes ipc 2222 pdf ipc- d- 249.  examples are: ipc- 2222 ipc- 2223 ipc- 2224.  ipc- 2222a sectional design standard for rigid organic printed boards developed by the ipc- 2221/ 2222 task group ( d- 31b) of the rigid printed board committee ( d- 30) of ipc users of this publication are encouraged to participate in the development of future revisions.  generic performance specification for printed boards.  users of this publication are encouraged to participate in the development of future revisions.  ipc- 2222 rigid organic printed board structure design ipc- 2223 flexible printed board structure design ipc- 2225 organic, mcm- l, printed board structure design ipc- 2226 high density interconnect ( hdi) structure design the list is a partial summary and is not inherently a part of this generic standard.  exist between ipc- 2222 and those listed below, ipc- 2222.  from ‘ ‘ e’ ’ glass for printed board.  others also bought.  contact: ipc 2215 sanders road northbrook, ilinoistel 847 509.  developedby the ipc- 2221/ 2222 task group( d- 31b) of the rigid printedboardcommittee( d- 30) of ipc usersof this publicationare encouragedto participatein the developmentof futurerevisions.  exist between ipc- 2222 and those listed below, ipc- 2222 takes precedence.  ipc- am- 361 specification for rigid substrates for additive process boards ipc- tm- 650 test methods manual method 2.  the documents are a part.  2 documentation hierarchy this standard identifies the generic physical design principles, and is supplemented by various sectional documents that provide details and sharper focus on specific aspects of printed board technol- ogy.  the information contained herein is intended to supplement generic design requirements identified in ipc- 2221.  key concepts in ipc- 2222b are rigid laminate properties.  this standard establishes the specific requirements for the design of rigid organic printed boards and other forms of component mounting and interconnecting structures.</p></translate>
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