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<p>No physical damage that would impair product performance. EIA, Condition A Test Condition Letter DTEST LIMIT SPECIFICATION DOCUMENT PS Rev A–  EIA Condition V Test letter A Pass Removal Force •N minimum EIA Pass Insertion Force •N maximum EIA Pass Dielectric Withstanding Voltage  Per EIA, No mechanical damage. Test Condition Letter DTEST LIMIT SPECIFICATION DOCUMENT PS Rev A– zQSFP+ Passive Copper Cable Assembly Product Spec Test: Clamp & vibrate per EIAF, TC-VII, Test condition letter – D,minutes in X, Y & Z axis This standard describes recommended test sequences to determine the susceptibility of contacts to fretting corrosion that is a major and significant failure mechanism that can be caused by vibration View All. Find the most up-to-date version of EIA at GlobalSpec EIA, Test Condition VII, Level D Subject mated connector to G’s RMS betweenand Hz. Applyminutes in each ofmutually perpendicular planes. or call Global Engineering Documents, USA and Canada () International () EIA Condition V Test letter A Pass Removal Force •N minimum EIA Pass Insertion Force •N maximum EIA Pass Dielectric Withstanding Voltage Electrical Vrms @ sea level EIAB Pass Insulation Resistance •X Ohms @ V dc EIA Pass Impedance ±Ohms @ps (20%%) EIAF – Vibration Test Procedure for Electrical Connectors. See FigureMechanical Shock No electrical discontinuity greater thanμs shall occur. See Figure  EIAF – Vibration Test Procedure for Electrical Connectors. Technology Strategy & Standards Department Wilson Boulevard Arlington, VA PRICE: Please refer to the current Catalog of EIA Electronic Industries Alliance  EIA, Test Condition VII, Level D Subject mated connector to G’s RMS betweenand Hz. Applyminutes in each ofmutually perpendicular planes. TC-VII. TC-VII. Contact resistance is not ExceedmilliohmsVibration Mate connectors, and subject to the following vibration conditions, Technology Strategy & Standards Department Wilson Boulevard Arlington, VA PRICE: Please refer to the current Catalog of EIA Electronic Industries Alliance Standards and Engineering Publications.</p></translate>
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