Wikifab - Contributions de l’utilisateur [fr]

Fichier:Powder Metallurgy Process to Make Sputtering Targets- Step-by-Step flowchart target material.jpg

2025-06-13T08:11:26Z

JulissaGreen : Powder_Metallurgy_Process_to_Make_Sputtering_Targets-_Step-by-Step_flowchart_target_material

Powder_Metallurgy_Process_to_Make_Sputtering_Targets-_Step-by-Step_flowchart_target_material

Fichier:Choosing the Right Grinding Media for Ball Milling ceramic grinding media.png

2025-06-13T07:58:10Z

JulissaGreen : Choosing_the_Right_Grinding_Media_for_Ball_Milling_ceramic_grinding_media

Choosing_the_Right_Grinding_Media_for_Ball_Milling_ceramic_grinding_media

Fichier:Preparation of CIGS Absorber Layer in Thin Film Solar Cells thin-film-solar-cell.jpg

2025-05-30T06:39:04Z

JulissaGreen : Preparation_of_CIGS_Absorber_Layer_in_Thin_Film_Solar_Cells_thin-film-solar-cell

Preparation_of_CIGS_Absorber_Layer_in_Thin_Film_Solar_Cells_thin-film-solar-cell

How to Clean a Sputter Target

2025-05-30T06:30:49Z

JulissaGreen : Page créée avec « {{Tuto Details |Main_Picture=How_to_Clean_a_Sputter_Target_Target-cleaning.jpg |Main_Picture_annotation={"version":"3.5.0","objects":[{"type":"image","version":"3.5.0","or... »

{{Tuto Details
|Main_Picture=How_to_Clean_a_Sputter_Target_Target-cleaning.jpg
|Main_Picture_annotation={"version":"3.5.0","objects":[{"type":"image","version":"3.5.0","originX":"left","originY":"top","left":0,"top":0,"width":600,"height":444,"fill":"rgb(0,0,0)","stroke":null,"strokeWidth":0,"strokeDashArray":null,"strokeLineCap":"butt","strokeDashOffset":0,"strokeLineJoin":"miter","strokeMiterLimit":4,"scaleX":1.01,"scaleY":1.01,"angle":0,"flipX":false,"flipY":false,"opacity":1,"shadow":null,"visible":true,"clipTo":null,"backgroundColor":"","fillRule":"nonzero","paintFirst":"fill","globalCompositeOperation":"source-over","transformMatrix":null,"skewX":0,"skewY":0,"crossOrigin":"","cropX":0,"cropY":0,"src":"https://wikifab.org/images/d/dd/How_to_Clean_a_Sputter_Target_Target-cleaning.jpg","filters":[]}],"height":450.3157894736842,"width":600}
|Licences=Attribution (CC BY)
|Description=<translate>This tutorial provides a clear and practical guide on how to properly clean a sputter target to ensure its surface is free from contaminants that could affect sputtering performance.</translate>
|Area=Science and Biology
|Type=Technique
|Difficulty=Easy
|Duration=1.5
|Duration-type=hour(s)
|Cost=0
|Currency=EUR (€)
|Tags=Sputtering Target Cleaning, Physical Vapor Deposition, Thin Film Deposition
}}
{{Introduction
|Introduction=<translate>Proper cleaning of a sputter target is essential to ensure optimal performance and prevent contamination during the sputtering process. Follow these steps carefully:</translate>
}}
{{Materials
|Material=<translate>* Acetone: Used to dissolve and remove oils, grease, and organic contaminants from the target surface.
* Alcohol (Isopropyl or Ethanol): Further cleans the surface by removing residual contaminants and solvent traces.
* Deionized Water: Used to rinse off solvents and impurities without introducing minerals or ions that could contaminate the target.
* High-Purity Argon Gas: Employed in a high-pressure, low-moisture form to blow away any remaining particles and prevent arcing during sputtering.</translate>
|Tools=<translate>*Soft, Lint-Free Cloths: For wiping the target gently without scratching or leaving fibers.
*Oven or Drying Chamber: Capable of maintaining around 100°C to dry the target thoroughly after washing.
*Compressed Argon Gas Supply with Regulator: To provide controlled high-pressure argon for the final rinse.
*Protective Gloves and Safety Equipment: To handle solvents safely and avoid contamination.</translate>
}}
{{Tuto Step
|Step_Title=<translate>Acetone Cleaning</translate>
|Step_Content=<translate>Take a soft, lint-free cloth and soak it in acetone. Gently wipe the surface of the sputter target to remove oils, grease, and other contaminants.</translate>
}}
{{Tuto Step
|Step_Title=<translate>Alcohol Cleaning</translate>
|Step_Content=<translate>Repeat the cleaning process using a soft cloth soaked in alcohol. This helps to further eliminate any remaining residues and prepares the surface for rinsing.</translate>
}}
{{Tuto Step
|Step_Title=<translate>Deionized Water Wash and Drying</translate>
|Step_Content=<translate>Rinse the target thoroughly with deionized water to remove any solvent traces. After washing, place the target in an oven and dry it at 100°C for 30 minutes to ensure all moisture is evaporated.</translate>
}}
{{Tuto Step
|Step_Title=<translate>Argon Rinse</translate>
|Step_Content=<translate>Finally, rinse the target with high-pressure, low-moisture argon gas. This step removes any residual particles that could cause arcing or defects during sputtering.</translate>
}}
{{Notes
|Notes=<translate>#“Five Points for Sputtering Target Maintenance.” ''Sputter Targets'', Stanford Advanced Materials, [http://www.sputtertargets.net/five-points-for-sputtering-target-maintenance www.sputtertargets.net/five-points-for-sputtering-target-maintenance]. Accessed 30 May 2025.
#“Sputter Target - an overview.” ScienceDirect Topics.
#“On the target surface cleanness during magnetron sputtering.” Surface and Coatings Technology, ScienceDirect, 2015.</translate>
}}
{{PageLang
|SourceLanguage=none
|IsTranslation=0
|Language=en
}}
{{Tuto Status
|Complete=Published
}}

Fichier:How to Clean a Sputter Target Target-cleaning.jpg

2025-05-30T06:23:56Z

JulissaGreen : How_to_Clean_a_Sputter_Target_Target-cleaning

How_to_Clean_a_Sputter_Target_Target-cleaning

How to Make Copper Sputter Target

2025-05-30T06:21:01Z

JulissaGreen :

{{Tuto Details
|Main_Picture=How_to_Make_Copper_Sputter_Target_Copper-sputtering-targets.jpg
|Main_Picture_annotation={"version":"3.5.0","objects":[{"type":"image","version":"3.5.0","originX":"left","originY":"top","left":15,"top":-1,"width":856,"height":589,"fill":"rgb(0,0,0)","stroke":null,"strokeWidth":0,"strokeDashArray":null,"strokeLineCap":"butt","strokeDashOffset":0,"strokeLineJoin":"miter","strokeMiterLimit":4,"scaleX":0.68,"scaleY":0.68,"angle":0,"flipX":false,"flipY":false,"opacity":1,"shadow":null,"visible":true,"clipTo":null,"backgroundColor":"","fillRule":"nonzero","paintFirst":"fill","globalCompositeOperation":"source-over","transformMatrix":null,"skewX":0,"skewY":0,"crossOrigin":"","cropX":0,"cropY":0,"src":"https://wikifab.org/images/f/f4/How_to_Make_Copper_Sputter_Target_Copper-sputtering-targets.jpg","filters":[]}],"height":450.4596527068437,"width":600}
|Licences=Attribution (CC BY)
|Description=<translate>This tutorial provides a detailed, step-by-step guide on how to manufacture copper sputter targets, emphasizing the transformation from raw copper ore to the finished target suitable for vacuum coating applications.</translate>
|Area=Energy, Science and Biology
|Type=Creation
|Difficulty=Medium
|Duration=24
|Duration-type=hour(s)
|Cost=0
|Currency=USD ($)
|Tags=sputtering, sputtertargets, physicalvapordeposition
}}
{{Introduction
|Introduction=<translate>Copper sputtering targets are excellent sputtering materials in the vacuum coating industry. Sputtering targets are a special group of materials, especially for thin-film coating.</translate>
}}
{{Materials
|Material=<translate>#Sulfide ore: chalcopyrite (CuFeS2), porphyrite (Cu5FeS4) and chalcopyrite (Cu2S).
#Oxidized ore: cupro ore (Cu2O). malachite, [Cu2(OH)2CO3], chrysocolla (CuSiO3·2H2O).
#Natural copper</translate>
|Tools=<translate>smelting, forging, rolling, and heat-treating</translate>
}}
{{Tuto Step
|Step_Title=<translate>Smelting and Purification of Copper Ore</translate>
|Step_Content=<translate>The initial step in making a copper sputter target is smelting copper ore, which serves as the raw material. Copper ores are categorized into three types:

*Sulfide ores: chalcopyrite (CuFeS2), porphyrite (Cu5FeS4), and chalcocite (Cu2S)
*Oxidized ores: cuprite (Cu2O), malachite [Cu2(OH)2CO3], chrysocolla (CuSiO3·2H2O)
*Natural copper

Copper ores with about 1% copper content (ranging from 0.5% to 3%) are economically viable for mining. Impurities such as gangue are removed by flotation to concentrate copper content to 8%-35%. The extracted crude copper is then purified through multiple electrolysis and regional melting processes to achieve high purity levels of 99.95%, 99.99%, 99.999%, and even 99.9999%.</translate>
}}
{{Tuto Step
|Step_Title=<translate>Forging, Rolling, and Heat Treatment of Copper Ingots</translate>
|Step_Content=<translate>After purification, the high-purity copper ingots undergo mechanical processing including forging, rolling, and heat treatment. These processes refine the copper's microstructure by reducing crystal grain size and increasing density. This treatment is essential to meet the stringent requirements for copper sputter targets, ensuring uniformity and stability of the material during sputtering.</translate>
}}
{{Tuto Step
|Step_Title=<translate>Precision Machining and Final Shaping</translate>
|Step_Content=<translate>Following deformation treatments, the copper material is machined to achieve high precision dimensions and superior surface quality. The final target is shaped to fit vacuum coating equipment specifications. Copper sputter targets are commonly available in planar (flat) and rotary (cylindrical) forms, with customized shapes also possible depending on application needs.</translate>
}}
{{Notes
|Notes=<translate># Sputter Targets. “Copper Sputter Target – An Excellent Sputtering Material.” ''Sputter Targets'', Stanford Advanced Materials, [http://www.sputtertargets.net/blog/copper-sputter-target-an-excellent-sputtering-material.html www.sputtertargets.net/blog/copper-sputter-target-an-excellent-sputtering-material.html]. Accessed 30 May 2025.
# Kanno, Isaku, et al. “Copper Sputtering Target Assembly and Method of Making Same.” ''US Patent'' US6645427B1, 11 Nov. 2003. United States Patent and Trademark Office, patents.google.com/patent/US6645427B1/en. Accessed 30 May 2025.</translate>
}}
{{PageLang
|Language=en
|SourceLanguage=none
|IsTranslation=0
}}
{{Tuto Status
|Complete=Published
}}

How to Make Copper Sputter Target

2025-05-30T06:20:37Z

JulissaGreen : Page créée avec « {{Tuto Details |Main_Picture=How_to_Make_Copper_Sputter_Target_Copper-sputtering-targets.jpg |Main_Picture_annotation={"version":"3.5.0","objects":[{"type":"image","versio... »

{{Tuto Details
|Main_Picture=How_to_Make_Copper_Sputter_Target_Copper-sputtering-targets.jpg
|Main_Picture_annotation={"version":"3.5.0","objects":[{"type":"image","version":"3.5.0","originX":"left","originY":"top","left":15,"top":-1,"width":856,"height":589,"fill":"rgb(0,0,0)","stroke":null,"strokeWidth":0,"strokeDashArray":null,"strokeLineCap":"butt","strokeDashOffset":0,"strokeLineJoin":"miter","strokeMiterLimit":4,"scaleX":0.68,"scaleY":0.68,"angle":0,"flipX":false,"flipY":false,"opacity":1,"shadow":null,"visible":true,"clipTo":null,"backgroundColor":"","fillRule":"nonzero","paintFirst":"fill","globalCompositeOperation":"source-over","transformMatrix":null,"skewX":0,"skewY":0,"crossOrigin":"","cropX":0,"cropY":0,"src":"https://wikifab.org/images/f/f4/How_to_Make_Copper_Sputter_Target_Copper-sputtering-targets.jpg","filters":[]}],"height":450.4596527068437,"width":600}
|Licences=Attribution (CC BY)
|Description=<translate>This tutorial provides a detailed, step-by-step guide on how to manufacture copper sputter targets, emphasizing the transformation from raw copper ore to the finished target suitable for vacuum coating applications.</translate>
|Area=Energy, Science and Biology
|Type=Creation
|Difficulty=Medium
|Duration=24
|Duration-type=hour(s)
|Cost=0
|Currency=USD ($)
|Tags=sputtering, sputtertargets, physicalvapordeposition
}}
{{Introduction
|Introduction=<translate>Copper sputtering targets are excellent sputtering materials in the vacuum coating industry. Sputtering targets are a special group of materials, especially for thin-film coating.</translate>
}}
{{Materials
|Material=<translate># Sulfide ore: chalcopyrite (CuFeS2), porphyrite (Cu5FeS4) and chalcopyrite (Cu2S).
# Oxidized ore: cupro ore (Cu2O). malachite, [Cu2(OH)2CO3], chrysocolla (CuSiO3·2H2O).
# Natural copper

# Sulfide ore: chalcopyrite (CuFeS2), porphyrite (Cu5FeS4) and chalcopyrite (Cu2S).
# Oxidized ore: cupro ore (Cu2O). malachite, [Cu2(OH)2CO3], chrysocolla (CuSiO3·2H2O).
# Natural copper</translate>
|Tools=<translate>smelting, forging, rolling, and heat-treating</translate>
}}
{{Tuto Step
|Step_Title=<translate>Smelting and Purification of Copper Ore</translate>
|Step_Content=<translate>The initial step in making a copper sputter target is smelting copper ore, which serves as the raw material. Copper ores are categorized into three types:

*Sulfide ores: chalcopyrite (CuFeS2), porphyrite (Cu5FeS4), and chalcocite (Cu2S)
*Oxidized ores: cuprite (Cu2O), malachite [Cu2(OH)2CO3], chrysocolla (CuSiO3·2H2O)
*Natural copper

Copper ores with about 1% copper content (ranging from 0.5% to 3%) are economically viable for mining. Impurities such as gangue are removed by flotation to concentrate copper content to 8%-35%. The extracted crude copper is then purified through multiple electrolysis and regional melting processes to achieve high purity levels of 99.95%, 99.99%, 99.999%, and even 99.9999%.</translate>
}}
{{Tuto Step
|Step_Title=<translate>Forging, Rolling, and Heat Treatment of Copper Ingots</translate>
|Step_Content=<translate>After purification, the high-purity copper ingots undergo mechanical processing including forging, rolling, and heat treatment. These processes refine the copper's microstructure by reducing crystal grain size and increasing density. This treatment is essential to meet the stringent requirements for copper sputter targets, ensuring uniformity and stability of the material during sputtering.</translate>
}}
{{Tuto Step
|Step_Title=<translate>Precision Machining and Final Shaping</translate>
|Step_Content=<translate>Following deformation treatments, the copper material is machined to achieve high precision dimensions and superior surface quality. The final target is shaped to fit vacuum coating equipment specifications. Copper sputter targets are commonly available in planar (flat) and rotary (cylindrical) forms, with customized shapes also possible depending on application needs.</translate>
}}
{{Notes
|Notes=<translate># Sputter Targets. “Copper Sputter Target – An Excellent Sputtering Material.” ''Sputter Targets'', Stanford Advanced Materials, [http://www.sputtertargets.net/blog/copper-sputter-target-an-excellent-sputtering-material.html www.sputtertargets.net/blog/copper-sputter-target-an-excellent-sputtering-material.html]. Accessed 30 May 2025.
# Kanno, Isaku, et al. “Copper Sputtering Target Assembly and Method of Making Same.” ''US Patent'' US6645427B1, 11 Nov. 2003. United States Patent and Trademark Office, patents.google.com/patent/US6645427B1/en. Accessed 30 May 2025.</translate>
}}
{{PageLang
|SourceLanguage=none
|IsTranslation=0
|Language=en
}}
{{Tuto Status
|Complete=Published
}}

Fichier:How to Make Copper Sputter Target Copper-sputtering-targets.jpg

2025-05-30T06:11:25Z

JulissaGreen : How_to_Make_Copper_Sputter_Target_Copper-sputtering-targets

How_to_Make_Copper_Sputter_Target_Copper-sputtering-targets

Utilisateur:JulissaGreen

2025-05-30T05:46:06Z

JulissaGreen : create user page